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MICROELECTRONICS JOURNAL

MICROELECTRONICS JOURNAL期刊基本信息

  • 簡(jiǎn)稱:MICROELECTR J
  • 大類:工程技術(shù)
  • 小類:工程:電子與電氣
  • ISSN:0026-2692
  • IF值:1.284
  • 周期:Monthly
  • 是否SCI:SCIE
  • 是否OA:No
  • 出版地:ENGLAND
  • 年文章數(shù):177
  • 審稿速度:約3.0個(gè)月
  • 平均錄用比例:容易
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MICROELECTRONICS JOURNAL中文簡(jiǎn)介

《微電子雜志》自1969年出版以來(lái),是一個(gè)國(guó)際論壇,旨在傳播微電子系統(tǒng)、電路和新興技術(shù)的研究和應(yīng)用。發(fā)表在《微電子雜志》上的論文都經(jīng)過(guò)同行評(píng)審,以確保原創(chuàng)性、相關(guān)性和及時(shí)性。因此,該雜志提供了一份關(guān)于微電子電路和系統(tǒng)的全球、定期和全面的更新。《微電子雜志》邀請(qǐng)發(fā)表論文,介紹在以下所有領(lǐng)域的重要研究和應(yīng)用。還將考慮涵蓋最新發(fā)展的全面審查/調(diào)查文件。《微電子雜志》涵蓋了電路和系統(tǒng)。本主題包括但不限于?模擬、數(shù)字、混合和射頻電路及相關(guān)設(shè)計(jì)方法?邏輯、架構(gòu)和系統(tǒng)級(jí)綜合?測(cè)試、可測(cè)試性設(shè)計(jì)、內(nèi)置自檢?面積、功率和熱分析和設(shè)計(jì)?混合域模擬和設(shè)計(jì)?嵌入式系統(tǒng)?非馮諾依曼計(jì)算及相關(guān)技術(shù)和電路?設(shè)計(jì)和測(cè)試高復(fù)雜性系統(tǒng)集成?SOC、NOC、SIP和NIP設(shè)計(jì)和測(cè)試?三維集成設(shè)計(jì)與分析?新興設(shè)備技術(shù)和電路,如場(chǎng)效應(yīng)晶體管、集合、自旋電子學(xué)、SFQ、MTJ等。信號(hào)和圖像處理等應(yīng)用方面,包括密碼電路、傳感器和執(zhí)行器(包括傳感器網(wǎng)絡(luò))、可靠性和質(zhì)量問(wèn)題以及經(jīng)濟(jì)模型也受到歡迎。

MICROELECTRONICS JOURNAL英文簡(jiǎn)介

Published since 1969, the Microelectronics Journal is an international forum for the dissemination of research and applications of microelectronic systems, circuits, and emerging technologies. Papers published in the Microelectronics Journal have undergone peer review to ensure originality, relevance, and timeliness. The journal thus provides a worldwide, regular, and comprehensive update on microelectronic circuits and systems.The Microelectronics Journal invites papers describing significant research and applications in all of the areas listed below. Comprehensive review/survey papers covering recent developments will also be considered. The Microelectronics Journal covers circuits and systems. This topic includes but is not limited to? Analog, digital, mixed, and RF circuits and related design methodologies? Logic, architectural, and system level synthesis? Testing, design for testability, built-in self-test? Area, power, and thermal analysis and design? Mixed-domain simulation and design? Embedded systems? Non-von Neumann computing and related technologies and circuits? Design and test of high complexity systems integration? SoC, NoC, SIP, and NIP design and test? 3-D integration design and analysis? Emerging device technologies and circuits, such as FinFETs, SETs, spintronics, SFQ, MTJ, etc.Application aspects such as signal and image processing including circuits for cryptography, sensors, and actuators including sensor networks, reliability and quality issues, and economic models are also welcome.

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