焊接和表面貼裝技術(shù)致力于在這一重要領(lǐng)域的知識(shí)和專(zhuān)業(yè)技術(shù)體系內(nèi)對(duì)研究和應(yīng)用的進(jìn)展作出重要貢獻(xiàn)。焊錫和表面貼裝技術(shù)是其姊妹出版物，電路世界和微電子國(guó)際。該雜志包括一個(gè)多學(xué)科研究的關(guān)鍵材料和技術(shù)用于組裝最先進(jìn)的功能性電子設(shè)備。重點(diǎn)是通過(guò)焊接組裝設(shè)備和互連組件，同時(shí)還包括廣泛的相關(guān)方法。涵蓋的主題范圍包括：焊接科學(xué)與技術(shù)新的焊接工藝和新的焊接合金表面貼裝技術(shù)表面安裝組件先進(jìn)的封裝技術(shù)和3D互連倒裝芯片/BGA/SIP/TSV新型基板和嵌入式組件可焊表面和涂層絲網(wǎng)印刷導(dǎo)電粘合劑和保形涂層可靠性質(zhì)量控制檢驗(yàn)和測(cè)試返工和修理環(huán)境因素

Soldering & Surface Mount Technology seeks to make an important contribution to the advancement of research and application within the technical body of knowledge and expertise in this vital area. Soldering & Surface Mount Technology compliments its sister publications; Circuit World and Microelectronics International.The journal comprises a multidisciplinary study of the key materials and technologies used to assemble state of the art functional electronic devices. The key focus is on assembling devices and interconnecting components via soldering, whilst also embracing a broad range of related approaches. Among the range of topics covered are:Soldering science and technologyNovel soldering processes and new solder alloysSurface mount technology (SMT)Surface mount assemblyAdvanced packaging technologies and 3D interconnectsFlip chip/BGA/SiP/TSVNovel substrates and embedded componentsSolderable finishes and coatingsScreen printingConductive adhesives and conformal coatingsReliabilityQuality controlInspection and testingRework and repairEnvironmental aspects