微電子國際提供了一個權(quán)威的、國際的和獨(dú)立的論壇，在這個快速發(fā)展和變化的技術(shù)領(lǐng)域內(nèi)，對與先進(jìn)封裝、微電路工程、互連、半導(dǎo)體技術(shù)和系統(tǒng)工程相關(guān)的研究和開發(fā)、應(yīng)用、過程和當(dāng)前實踐進(jìn)行關(guān)鍵評估和傳播。它代表了一種當(dāng)前的、全面的、實用的信息工具。該雜志包括一個多學(xué)科研究的各種技術(shù)，過程和當(dāng)前的實踐與設(shè)計，制造，裝配和各種應(yīng)用的微型電子設(shè)備和先進(jìn)的軟件包。

Microelectronics International provides an authoritative, international and independent forum for the critical evaluation and dissemination of research and development, applications, processes and current practices relating to advanced packaging, micro-circuit engineering, interconnection, semiconductor technology and systems engineering within this fast moving and changing technological field. It represents a current, comprehensive and practical information tool. The journal comprises a multi-disciplinary study of the various technologies, processes and current practices associated with the design, manufacture, assembly and various applications of miniaturized electronic devices and advanced packages.